Characteristics of current crowding in flip-chip solder bumps

Microelectronics Reliability

Volumn 46, Issue 5-6, 2006, Pages 915-922

  Lai, Yi Shao ^a   Kao, Chin Li ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL GEOMETRY; ELECTRIC CURRENTS; ELECTROMIGRATION; FINITE ELEMENT METHOD; SOLDERING ALLOYS; STRUCTURAL ANALYSIS; VOLUMETRIC ANALYSIS;

CONSTANT APPLIED CURRENT; ELECTROMIGRATION FAILURES; FLIP-CHIP PACKAGE ASSEMBLY; SOLDER BUMPS;

FLIP CHIP DEVICES;

EID: 33645144766     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.02.007     Document Type: Conference Paper

References (11)

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