Electromigration effect on pancake type void propagation near the interface of bulk solder and intermetallic compound

Journal of Applied Physics

Volumn 105, Issue 6, 2009, Pages

  Yao, Yao ^a   Keer, Leon M ^a   Fine, Morris E ^a  

^a Northwestern University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BULK SOLDERS; CURRENT CROWDING EFFECTS; ELECTRONIC DEVICES; EUTECTIC SOLDERS; FAILURE MECHANISMS; HIGH CURRENT DENSITIES; INTERCONNECT FAILURES; INTERMETALLIC COMPOUNDS; KINETIC MODELS; MASS DIFFUSIONS; PROPAGATION SPEED; PROPAGATION VELOCITIES; SOLDER INTERCONNECTS; STRESS GRADIENTS; STRESS MIGRATIONS; THREE-DIMENSIONAL FINITE ELEMENT ANALYSIS; VOID DEFECTS;

BRAZING; ELECTROMIGRATION; ELECTRONICS INDUSTRY; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; THREE DIMENSIONAL; WELDING;

TIN;

EID: 63749125050     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3088946     Document Type: Article

References (27)

1. H. Gan, W. J. Choi, G. Xu, and K. N. Tu, JOM 1047-4838 10.1007/BF02822618 54, 34 (2002).
2. T. Miyazaki and T. Omata, Electromigration Degradation Mechanism for Pb-free Flip-chip Micro Solder Bumps, Microelectronics Reliability, Proceedings of the 17th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (Elsevier Ltd, Wuppertal, Germany, 2006), Vol. 46, pp. 1898-1903.
3. S. Gee, N. Kelkar, J. Huang, and K. N. Tu, Lead-Free and PbSn Bump Electromigration Testing, ASME InterPACK, San Francisco, CA, 2005, ASME, pp. 1313-1321.
4. C. C. Lee, C. C. Lee, C. C. Chiu, C. C. Chen, F. Kuo, and K. N. Chiang, Electromigration Characteristic of SnAg3.0Cu0.5 Flip Chip Interconnection, Electronic Component and Technology Conference, 2006 (unpublished).
5. H. B. Huntington and A. R. Grone, J. Phys. Chem. Solids 0022-3697 10.1016/0022-3697(61)90138-X 20, 76 (1961).
6. I. A. Blech and C. Herring, Appl. Phys. Lett. 0003-6951 10.1063/1.89024 29, 131 (1976).
7. J. R. Rice and T. J. Chuang, J. Am. Ceram. Soc. 0002-7820 10.1111/j.1151-2916.1981.tb09557.x 64, 46 (1981).
8. A. F. Bower and L. B. Freund, J. Appl. Phys. 0021-8979 10.1063/1.354480 74, 3855 (1993).
9. M. D. Thouless, H. Yu, Z. Zhao, and W. Yang, J. Mech. Phys. Solids 44, 371 (1996). 0022-5096
10. J. Cho, M. R. Gungor, and D. Maroudas, J. Appl. Phys. 101, 023518 (2007). 0021-8979
11. C. Basaran and M. Lin, Mech. Mater. 40, 66 (2008). 0167-6636
12. Z. Suo, W. Wang, and M. Yang, Appl. Phys. Lett. 64, 1944 (1994). 0003-6951
13. W. Wang, Z. Suo, and T. H. Hao, J. Appl. Phys. 79, 2394 (1996). 0021-8979
14. L. Zhang, S. Ou, J. Huang, and K. N. Tu, Appl. Phys. Lett. 0003-6951 10.1063/1.2158702 88, 012106 (2006).
15. M. Hauschildt, M. Gall, S. Thrasher, P. Justison, R. Hernandez, H. Kawasaki, and P. S. Ho, J. Appl. Phys. 0021-8979 10.1063/1.2655531 101, 043523 (2007).
16. A. Einstein, Ann. Phys. 0003-3804 10.1002/andp.19053220806 322, 549 (1905).
17. C. Herring, In the Physics of Power Metallurgy (McGraw-Hill, New York, 1951), p. 143.
18. E. Yeh and K. N. Tu, J. Appl. Phys. 0021-8979 10.1063/1.1314613 88, 5680 (2000).
19. A. T. Wu, K. N. Tu, J. R. Lloyd, N. Tamura, B. C. Valek, and C. R. Kao, Appl. Phys. Lett. 0003-6951 10.1063/1.1795353 85, 2490 (2004).
20. D. Turnbull, in In Solid State Physics, edited by, F. Seitz, and, D. Turnbull, (Academic, New York, 1956), Vol. 3.
21. J. C. Maxwell, Philos. Trans. R. Soc. Lond. 155, 459 (1865). 0261-0523
22. Handbook of Chemistry and Physics, 40th ed. (Chemical Rubber Publishing Company, Cleveland, OH, 1958), p. 3112.
23. ABAQUS documentation 6.6.3, 2007.
24. NIST database for solder properties, Release 4.0, 2002.
25. W. Yang, W. Wang, and Z. Suo, J. Mech. Phys. Solids 0022-5096 10.1016/0022-5096(94)90077-9 42, 897 (1994).
26. A. M. Lyapunov, Stability of Motion (Academic, New York, 1966).
27. S. M. Alam, C. L. Gan, C. V. Thompson, and D. E. Troxel, Microelectron. J. 38, 463 (2007). 0026-2692