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Volumn 89, Issue 2, 2006, Pages

Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration

(5) Liang, S W a Chang, Y W a Shao, T L a Chen, Chih a Tu, K N b

a NATIONAL CHIAO TUNG UNIVERSITY (Taiwan)

b UNIVERSITY OF CALIFORNIA (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTING PATH; TEMPERATURE REDISTRIBUTIONS; THERMOELECTRICAL COUPLED MODELING; VOID FORMATION;

COMPUTER SIMULATION; CURRENT DENSITY; ELECTROMIGRATION; METALLIZING; SOLDERED JOINTS; TEMPERATURE DISTRIBUTION; THERMOELECTRICITY;

FLIP CHIP DEVICES;

EID: 33746036472 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.2220550 Document Type: Article

Times cited : (63)

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