Effect of electromigration in the anodic Al interconnect on melting of flip chip solder joints

Applied Physics Letters

Volumn 90, Issue 21, 2007, Pages

  Ouyang, Fan Yi ^a   Tu, K N ^a   Kao, Chin Li ^b   Lai, Yi Shao ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROTHERMAL COUPLING ANALYSIS; FLIP CHIP SOLDER JOINTS; SOLDER BUMPS;

CURRENT DENSITY; ELECTROMIGRATION; FLIP CHIP DEVICES; JOULE HEATING; MELTING; OPTICAL INTERCONNECTS; SEMICONDUCTING TIN COMPOUNDS;

SOLDERED JOINTS;

EID: 34249734306     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2743395     Document Type: Article

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