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Science and Technology of Welding and Joining

Volumn 12, Issue 5, 2007, Pages 423-430

Factors influencing current density distribution and current crowding in flip chip solder joints

(4) Yu, C a Lu, H a Fan, R Z a Li, S M a

a SHANGHAI JIAO TONG UNIVERSITY (China)

Author keywords

Current crowding; Electromigration; FEM; Interfacial structure; Soldering

Indexed keywords

EID: 36448967151 PISSN: 13621718 EISSN: 13621718 Source Type: Journal
DOI: 10.1179/174329307X213774 Document Type: Article

Times cited : (4)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.