Geometry effects on the electromigration of eutectic SN/PB flip-chip solder bumps

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2006, Pages 243-249

  Eaton, Dennis H ^a   Rowatt, James D ^a   Dauksher, Walter J ^a  

^a BROADCOM CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY EXPONENTS; EUTECTIC SOLDER BUMPS; GEOMETRY EFFECTS;

ACTIVATION ENERGY; COMPUTATIONAL GEOMETRY; CURRENT DENSITY; ELECTROMIGRATION; FLIP CHIP DEVICES; SOLDERING ALLOYS; THERMAL EFFECTS;

EUTECTICS;

EID: 34250709011     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2006.251223     Document Type: Conference Paper

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