Current crowding and its effects on electromigration and interfacial reaction in lead-free solder joints

Journal of Electronic Packaging

Volumn 130, Issue 3, 2008, Pages 0310081-0310085

  Lu, Hao ^a   Yu, Chun ^a   Li, Peilin ^a   Chen, Junmei ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Current crowding; Electromigration; Finite element analysis; Interfacial reaction; Sn 3.0Ag 0.5Cu

Indexed keywords

CATHODES; COPPER; ELECTROMIGRATION; LEAD-FREE SOLDERS; SILVER ALLOYS; SOLDERED JOINTS; TERNARY ALLOYS; TIN ALLOYS;

AREA RATIOS; CROSS SECTIONAL AREA; CROWDING FACTORS; CU LINES; CURRENT CROWDING; CURRENT DENSITY DISTRIBUTION; ELECTRICAL CONDUCTORS; FINITE ELEMENT ANALYSE; LEAD-FREE SOLDER JOINT; SN-3.0AG-0.5CU;

FINITE ELEMENT METHOD;

EID: 52649103035     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2957322     Document Type: Article

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