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Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 59-66

Cu pillar bumps as a lead-free drop-in replacement for solder-bumped, flip-chip interconnects

(2) Ebersberger, Bernd a Lee, Charles b,c

a INFINEON TECHNOLOGIES AG (Germany)

b INSTITUTE OF MICROELECTRONICS (Singapore)

c Infineon Technologies Asia Pacific (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COMPUTER NETWORKS; COPPER;

ELECTRONIC COMPONENTS; LEAD-FREE; SN-AG SOLDER;

LEAD;

EID: 51349126506 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2008.4549951 Document Type: Conference Paper

Times cited : (63)

References (11)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.