Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration

Applied Physics Letters

Volumn 88, Issue 17, 2006, Pages

  Liang, S W ^a   Chang, Y W ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELECTRIC CURRENTS; ELECTROMIGRATION; HEATING; SOLDERED JOINTS; THERMOELECTRICITY; THREE DIMENSIONAL COMPUTER GRAPHICS;

HOT-SPOT TEMPERATURES; JOULE HEATING; MEAN TIME TO FAILURES (MTTF); THERMOELECTRICAL SIMULATIONS;

FLIP CHIP DEVICES;

EID: 33646407132     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2198809     Document Type: Article

References (10)

1. K. N. Tu, J. Appl. Phys. 94, 5451 (2003).
2. International Technology Roadmap for Semiconductors, Assembly and Packaging Section, Semiconductor Industry Association, San Jose, CA, 2003, pp. 4-9.
3. W. J. Choi, E. C. C. Yeh, and K. N. Tu, J. Appl. Phys. 94, 5665 (2003).
4. T. L. Shao, S. H. Chiu, Chih Chen, D. J. Yao, and C. Y. Hsu, J. Electron. Mater. 33, 1350 (2004).
5. Everett C.C. Yeh, W. J. Choi, and K. N. Tu, Appl. Phys. Lett. 80, 4 (2002).
6. J. R. Black, IEEE Trans. Electron Devices ED-16, 338 (1969).
7. J. D. Wu, P. J. Zheng, Kelly Lee, C. T. Chiu, and J. J. Lee, Proceedings of the 52th Electronic Components and Technology Conference, IEEE Components, Packaging, and Manufacturing Technology Society, San Diego, CA, 2002 (unpublished), p. 452.
8. S. W. Liang, T. L. Shao, and Chih Chen, J. Mater. Res. 21, 137 (2006).
9. S. H. Chiu, T. L. Shao, Chih Chen, D. J. Yao, and C. Y. Hsu, Appl. Phys. Lett. 88, 022110 (2006).
10. S. Brandenburg and S. Yeh, Proceedings of Surface Mount International Conference and Exhibition, San Jose, CA, 23-27 August 1998 (SMTA, Edina, MN, 1998), p. 337.