Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints

Applied Physics Letters

Volumn 90, Issue 8, 2007, Pages

  Liang, S W ^a   Chiu, S H ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; COMPUTER SIMULATION; DEGRADATION; ELECTROMIGRATION; FINITE ELEMENT METHOD; SOLDERED JOINTS; TEMPERATURE DISTRIBUTION;

JOULE HEATING EFFECT; THERMOELECTRICAL SIMULATION;

FLIP CHIP DEVICES;

EID: 33847214483     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2644061     Document Type: Article

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