The effect of thermomigration on phase coarsening in a eutectic SnPb alloy

Journal of Electronic Materials

Volumn 36, Issue 11, 2007, Pages 1495-1500

  Chuang, Y C ^a   Liu, C Y ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Packaging; Thermomigration

Indexed keywords

COARSENING ENHANCEMENT; PHASE COARSENING; THERMOMIGRATION;

COARSENING; EUTECTICS; SOLDERING ALLOYS;

TIN ALLOYS;

EID: 35248900988     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0207-4     Document Type: Conference Paper

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