Current density dependence of electromigration-induced flip-chip Cu pad consumption

Applied Physics Letters

Volumn 89, Issue 10, 2006, Pages

  Lin, C T ^a   Chuang, Y C ^a   Wang, S J ^a   Liu, C Y ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRITICAL CURRENT DENSITY (SUPERCONDUCTIVITY); DISSOLUTION; ELECTROMIGRATION; SURFACE CHEMISTRY; TIN COMPOUNDS;

CURRENT DENSITY DEPENDENCE; ELECTROMIGRATION-INDUCED FLIP-CHIP CU PAD CONSUMPTION; INTERFACIAL COMPOUND LAYERS; INTERFACIAL CU-SN COMPOUNDS;

FLIP CHIP DEVICES;

EID: 33748517637     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2344857     Document Type: Article

References (14)

1. J. H. Lau, Flip Chip Techhnolodies (McGraw-Hill, New York, 1996).
2. Internation Technology Roadmap for Semiconductor, Semiconductor Industry Association, San Jose, CA, 1999.
3. C. Basaran, H. Ye, D. C. Hopkins, and J. K. Lin, J. Electron. Packag. 127, 157 (2005).
4. Y. H. Lin and C. R. Kao, J. Electron. Mater. 34, 27 (2005).
5. C. C. Lu, S. J. Wang, and C. Y. Liu, J. Electron. Mater. 32, 1515 (2003).
6. Y. H. Hsiao, Y. C. Chuang, and C. Y. Liu, Scr. Mater. 54, 661 (2006).
7. T. L. Shao, K. C. Lin, and C. Chen, J. Electron. Mater. 32, 1278 (2003).
8. Z. Mei, A. J. Sunwoo, and J. W. Morris, Jr., Metall. Trans. A 23A, 857, (1992).
9. H. B. Huntington, in Diffusion in Solids: Recent Developments, edited by A. S. Nowick and J. J. Burton (Academic, New York, 1979).
10. A. Gangulee and F. M. d'Heurle, Thin Solid Films 16, 227 (1973).
11. R. Rosenberg, J. Vac. Sci. Technol. 9, 289 (1972).
12. J. van Ek, J. P. Dekker, and A. Lodder, Phys. Rev. B 52, 8794 (1995).
13. Shengquan Ou and K. N. Tu, Proceedings of 55th Electronic Components and Technology Conference, San Diego, CA, 31 May-3 June 2005 (IEEE, Piscataway, NJ, 2005), Vol. 2, pp. 1445-1450.
14. H. Gan and K. N. Tu, J. Appl. Phys. 97, 063514 (2005).