Study of void formation due to electromigration in flip-chip solder joints using Kelvin bump probes

Applied Physics Letters

Volumn 89, Issue 3, 2006, Pages

  Chang, Y W ^a   Liang, S W ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; COMPUTER SIMULATION; ELECTROMIGRATION; FAILURE (MECHANICAL); PROBES; SOLDERED JOINTS;

BUMP RESISTANCE; KELVIN BUMP PROBES; VOID FORMATION;

FLIP CHIP DEVICES;

EID: 33746289858     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2226989     Document Type: Article

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