Effect of current crowding on whisker growth at the anode in flip chip solder joints

Applied Physics Letters

Volumn 91, Issue 23, 2007, Pages

  Ouyang, Fan Yi ^a   Chen, Kai ^a   Tu, K N ^a   Lai, Yi Shao ^b  

^a University of California   (United States)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL GROWTH; ELECTROMIGRATION; FLIP CHIP DEVICES; NANOINDENTATION; SOLDERED JOINTS;

ANODE CONTACT; ATOMIC FLUXES; SOLDER BUMP;

NANOWHISKERS;

EID: 36849037806     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2822446     Document Type: Article

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