Morphological evolution of voids by surface drift diffusion driven by the capillary, electromigration, and thermal-stress gradient induced by the steady state heat flow in passivated metallic thin films and flip-chip solder joints. II. Applications

Journal of Applied Physics

Volumn 104, Issue 2, 2008, Pages

  Ogurtani, Tarik Omer ^a   Akyildiz, Oncu ^a  

^a MIDDLE EAST TECHNICAL UNIVERSITY   (Turkey)

Author keywords

[No Author keywords available]

Indexed keywords

ATHERMAL; CURRENT CROWDING; CURRENT-FLUX; DEVICE RELIABILITY; DRIFT MOTION; DRIFT-DIFFUSION; ELECTROMIGRATION FORCES; EVAPORATION AND CONDENSATION; FLIP CHIPPING; FRONT-TRACKING; INTERCONNECT FAILURE; METALLIC THIN FILMS; MORPHOLOGICAL EVOLUTIONS; PHASE TRANSFORMATION; PROXIMITY EFFECTS; SOLDER JOINTS; STEADY-STATE HEAT FLOW; STRESS GRADIENTS; TRANSVERSE DIRECTION; UNDER-BUMP METALLURGY; VOID GROWTH; VOID NUCLEATION;

BRAZING; CHEMICAL ENGINEERING; COMPUTATIONAL METHODS; COMPUTER SIMULATION; CONDENSATION; ELECTROMIGRATION; FLIP CHIP DEVICES; GRADIENT METHODS; INTERMETALLICS; LIQUID PHASE EPITAXY; MATRIX ALGEBRA; METALLIZING; MOLECULAR BEAM EPITAXY; ORES; PASSIVATION; SEMICONDUCTOR DOPING; THERMAL EVAPORATION; THICK FILMS; THIN FILMS; WELDING;

SURFACE DIFFUSION;

EID: 84864975128     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2958303     Document Type: Article

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