Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints

Journal of Applied Physics

Volumn 100, Issue 3, 2006, Pages

  Huang, Annie T ^a   Tu, K N ^a   Lai, Yi Shao ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON CURRENT CROWDING REGION; FLIP CHIP COMPOSITES; PHASE MIGRATION; THERMOMIGRATION;

ELECTRIC CURRENTS; ELECTROMIGRATION; FLIP CHIP DEVICES; LEAD; MELTING; SOLDERED JOINTS; TIN;

INTERMETALLICS;

EID: 33747350507     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2227621     Document Type: Article

References (18)

1. J. H. Lau, Flip Chip Technologies (McGraw-Hill, New York, 1996).
2. E. M. Davis, W. E. Harding, R. S. Schwartz, and J. J. Corning, IBM J. Res. Dev. 44, 56 (2000).
3. L. R. Miller, IBM J. Res. Dev. 13, 239 (1969).
4. P. A. Totta and R. P. Sopher, IBM J. Res. Dev. 13, 226 (1969).
5. D. O. Powell and A. K. Trivedi, Proceedings of the 43rd Electronic Components and Technology Conference (IEEE, New York, NY, 1993), p. 182.
6. M. Pecht, Y. Fukuda, and S. Rajagopal, IEEE Trans. Electron. Packag. Manuf. 27, 221 (2004).
7. J. W. Nah, K. W. Paik, J. O. Suh, and K. N. Tu, J. Appl. Phys. 94, 7560 (2003).
8. Y.-H. Liu and K.-L. Lin, J. Mater. Res. 20, 2184 (2005).
9. E. C. C. Yeh, W. J. Choi, K. N. Tu, P. Elenius, and H. Balkan, Appl. Phys. Lett. 80, 580 (2002).
10. L. Zhang, S. Ou, J. Huang, K. N. Tu, S. Gee, and L. Nguyen, Appl. Phys. Lett. 88, 012106 (2006).
11. H. Ye, C. Basaran, and D. C. Hopkins, Appl. Phys. Lett. 82, 1045 (2003).
12. C. Basaran, H. Ye, D. C. Hopkins, D. R. Frear, and J. K. Lin, J. Electron. Packag. 127, 157 (2005).
13. W. Roush and J. Jaspal, Proceedings of the 32nd Electronic Components Conference, San Diego, CA, 1982, (unpublished), Vol. 32, pp. 342-345.
14. A. T. Huang, A. M. Gusak, and K. N. Tu, Appl. Phys. Lett. 88, 141911 (2006);
15. S. Brandenburg and S. Yeh, Proceeding of the Surface Mount International Conference and Exposition, San Jose, CA, (unpublished) p. 337.
16. T. Y. Lee, K. N. Tu, and D. R. Frear, J. Appl. Phys. 90, 4502 (2001).
17. C. Y. Liu, C. Chen, C. N. Liao, and K. N. Tu, Appl. Phys. Lett. 75, 58 (1999).
18. S. H. Chiu, T. L. Shao, C. Chen, D. J. Yao, and C. Y. Hsu., Appl. Phys. Lett. 88, 022110 (2006).