Current-induced weakening of Sn3.5Ag0.7Cu Pb-free solder joints

Scripta Materialia

Volumn 56, Issue 5, 2007, Pages 381-384

  Zhang, L ^a   Wang, Z G ^a   Shang, J K ^b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b United States of America   (United States)

Author keywords

Electromigration; Pb free solder; Solder joint; Strength

Indexed keywords

ANNEALING; CURRENT DENSITY; ELECTROMIGRATION; THERMAL EFFECTS;

HILLOCK FORMATION; MICROMECHANICAL TESTING; PB-FREE SOLDER; STRENGTH LOSS;

SOLDERED JOINTS;

EID: 33845673238     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2006.10.043     Document Type: Article

References (14)

1. Lau J.H. Filp Chip Technologies (1996), McGraw-Hill, New York
2. Lee T.Y., Tu K.N., and Frear D.R. J. Appl. Phys. 4502 (2001) 90
3. Tu K.N. J. Appl. Phys 5451 (2003) 94
4. Ye H., Basaran C., and Hopkins D.C. Int. J. Solids. Struct. 4021 (2003) 40
5. Choi W.J., Yeh E.C.C., and Tu K.N. J. Appl. Phys. 5665 (2003) 94
6. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, K.N. Tu, in: Proceedings of the 54th ECTC, Las Vegas, NV, 2004, pp. 668-674.
7. F. Ren, J. Nah, H. Gan, J. Suh, K.N. Tu, B. Xiong, L. Xu, J. Pang, Mater. Res. Soc. Symp. Proc. 863, Warrendale, PA, B10.2, 2005.
8. F. Ren, L. Xu, X. Zhang, J. Nah, J.H.L. Pang, K.N. Tu, in: Proceedings of the 2006 ECTC meeting, San Diego, CA, 2006.
9. Nucci J.A., Straub A., Bischoff E., Arzt E., and Volkert C.A. J. Mater. Res. 2727 (2002) 17
10. Bohm J., Volkert C.A., Monig R., Balk T.J., and Arzt E. J. Electron. Mater. 45 (2002) 31
11. Blech I.A. J. Appl. Phys. 1203 (1976) 47
12. Lu C.C., Wang S.J., and Liu C.Y. J. Electron. Mater. 1515 (2003) 32
13. Hirth J.P., and Lothe J. Theory of Dislocations (1982), John Wiley & Sons, Inc., New York
14. Nabarro F.R.N. Theory of Crystal Dislocations (1967), Dover Publications, New York