Effect of electromigration-induced back stress gradient on nanoindentation marker movement in SnAgCu solder joints

Applied Physics Letters

Volumn 89, Issue 22, 2006, Pages

  Xu, Luhua ^a   Pang, John H L ^a   Tu, K N ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACK STRESS GRADIENT; NANOINDENTATION MARKERS;

ANODES; CURRENT DENSITY; ELECTROMIGRATION; MATHEMATICAL MODELS; STRESS ANALYSIS; TIN COMPOUNDS;

SOLDERED JOINTS;

EID: 33751559729     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2397549     Document Type: Article

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