Effect of electromigration on mechanical shear behavior of flip chip solder joints

Journal of Materials Research

Volumn 21, Issue 3, 2006, Pages 698-702

  Nah, Jae Woong ^a   Ren, Fei ^a   PaiK, Kyung Wook ^b   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; FLIP CHIP DEVICES; INTERFACES (MATERIALS); INTERMETALLICS; RELIABILITY; SHEAR STRENGTH; SOLDERED JOINTS; STRESSES;

ELECTRON FLOW; FLIP CHIP SOLDER JOINTS; SHEAR INDUCED FRACTURE; UNDER BUMP METALLURGY;

ELECTROMIGRATION;

EID: 33645101178     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2006.0086     Document Type: Article

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