Thermomechanical stress and strain in solder joints during electromigration

Journal of Electronic Materials

Volumn 38, Issue 5, 2009, Pages 678-684

  Zhang, J S ^a   Xi, H J ^a   Wu, Y P ^a   Wu, F S ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Electromigration; Solder joint; Steady state; Strain; Thermomechanical stress

Indexed keywords

ARRAY PACKAGES; CURRENT CROWDING; DISTRIBUTION OF TEMPERATURES; ELECTRON FLOWS; FINITE-ELEMENT ANALYSIS; HEAT DISSIPATIONS; HIGHEST TEMPERATURES; INTERMETALLIC COMPOUNDS; NON-UNIFORM; NONSTEADY STATE; SOLDER JOINT; STEADY STATE; SYMMETRICAL STRUCTURES; THERMOMECHANICAL STRESS; UNIFORM DISTRIBUTIONS;

BRAZING; ELECTROMIGRATION; INTERMETALLICS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; THERMOMECHANICAL TREATMENT; WELDING;

SOLDERING ALLOYS;

EID: 62549147492     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0685-7     Document Type: Article

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