Thermomigration in SnPb composite flip chip solder joints

Applied Physics Letters

Volumn 88, Issue 14, 2006, Pages

  Huang, Annie T ^a   Gusak, A M ^a,c   Tu, K N ^a   Lai, Yi Shao ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^c CHERKASY NATIONAL UNIVERSITY   (Ukraine)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE SOLDER JOINTS; FLIP CHIP SOLDER JOINTS; TEMPERATURE GRADIENT; THERMOMIGRATION;

COMPOSITE MATERIALS; FLIP CHIP DEVICES; LEAD; THERMAL EFFECTS; TIN; TIN ALLOYS;

SOLDERED JOINTS;

EID: 33646681929     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2192694     Document Type: Article

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