Numerical simulation of current crowding phenomena and their effects on electromigration in very large scale integration interconnects

Journal of Applied Physics

Volumn 88, Issue 10, 2000, Pages 5680-5686

  Yeh, Everett C C ^a   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001610086     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1314613     Document Type: Article

References (18)

1. K. N. Tu, J. W. Mayer, and L. C. Feldman, Electronic Thin Film Science (Macmillan, New York, 1992), Chap. 14.
2. T. Kwok, T. Nguyen, P. Ho, and S. Yip, Proceedings of the 25th IEEE International Reliability Physics Symposium, San Diego, California, April 7-9, 1987, p. 130.
3. T. Kwok, T. Nguyen, S. Yip, and P. Ho, Proceedings of the 5th IEEE International VLSI Multilevel Interconnection Conference, Santa Clara, California, June 13-14, 1988, p. 252.
4. J. T. Trattles, A. G. O'Neill, and B. C. Mecrow, IEEE Trans. Electron Devices 40, 1344 (1993).
5. K. N. Tu, C. C. Yeh, C. Y. Liu, and C. Chen, Appl. Phys. Lett. 76, 988 (2000).
6. H. Okabayashi, H. Kitamura, M. Komatsu, and H. Mori, 3rd International Workshop on Stress-Induced Phenomena in Metallization, Palo Alto, CA, 1995 [AIP Conf. Proc. 373, 214 (1996)].
7. S. Shingubara, T. Osaka, S. Abdeslam, H. Sakue, and T. Takahagi, 4th International Workshop on Stress-Induced Phenomena in Metallization, Tokyo, Japan, 1997 [AIP Conf. Proc. 418, 159 (1998)].
8. K. N. Tu, C. Y. Liu, C. C. Yeh, and C. Chen (unpublished).
9. A. Bunde and S. Havlin, Fractals and Disordered Systems (Springer, New York, 1991).
10. C. C. Yeh, M. S. Chiou, and Y. J. Hsu, Thin Solid Films 297, 88 (1997).
11. S. Kirkpatrick, Phys. Rev. Lett. 27, 1772 (1971).
12. Y. Yuge, J. Stat. Phys. 16, 339 (1977).
13. C. C. Yeh and Klaus Y. J. Hsu, J. Appl. Phys. 83, 326 (1998).
14. ATLAS is a trademark of and copyrighted by Silvaco International, 4701 Patrick Henry Drive, Santa Clara, CA 95054.
15. One can find the detail current distribution of a Blech structure in Ref. 5.
16. H. Mori, H. Okabayashi, and M. Komatsu, Thin Solid Films 300, 25 (1997).
17. H. Kawasaki, C. Lee, and T. K. Yu, Thin Solid Films 250, 508 (1994).
18. A set of scanning electron micrograph pictures in Ref. 6 demonstrated this phenomenon.