Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization

Journal of Electronic Materials

Volumn 32, Issue 11, 2003, Pages 1222-1227

  Hsu, Ying Chao ^a   Shao, Tung Liang ^a   Yang, Ching Jung ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

BT board; Current crowding; Electromigration; Flip chip; Intermetallic compounds; Under bump metallization

Indexed keywords

ATOMS; CATHODES; COPPER; CURRENT DENSITY; ELECTRIC CURRENTS; ELECTROMIGRATION; ELECTRON TRANSPORT PROPERTIES; FLIP CHIP DEVICES; INTERMETALLICS; METALLIZING; TIN ALLOYS; TITANIUM ALLOYS;

CURRENT CROWDING; ELECTROMIGRATION DAMAGES; PAD METALLIZATION; UNDER BUMP METALLIZATION;

SOLDERED JOINTS;

EID: 0346846607     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0015-4     Document Type: Article

References (19)

1. K.N. Tu, J.W. Mayer, and L.C. Feldman, Electronic Thin Film Science (New York: Macmillan Publishing Company, 1992), p. 355.
2. J.H. Lau and S.-W.R. Lee, Chip Scale Package (New York: McGraw-Hill, 1999), p. 3.
3. H. Gan, W.J. Choi, G. Xu, and K.N. Tu, JOM 6, 34 (2002).
4. C.Y. Liu, C. Chen, and K.N. Tu, J. Appl. Phys. 88, 5703 (2000).
5. T.Y. Lee and K.N. Tu, J. Appl. Phys. 89, 3189 (2001).
6. K. Nakagawa, S. Baba, M. Watanabe, H. Matsushima, K. Harada, E. Hayashi, Q. Wu, A. Maeda, M. Nakanishi, and N. Ueda, Electron. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 2001), pp. 917-977.
7. J.D. Wu, P.J. Zheng, K. Lee, C.T. Chiu, and J.J. Lee, Electron. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 2002), pp. 452-457.
8. S.W. Chen, C.M. Chen, and W.C. Liu, J. Electron. Mater. 27, 1193 (1998).
9. C.M. Chen and S.W. Chen, J. Electron. Mater. 28, 902 (1999).
10. C.M. Chen and S.W. Chen, J. Electron. Mater. 29, 1222 (2000).
11. C.M. Chen and S.W. Chen, J. Appl. Phys. 90, 1208 (2001).
12. S.Y. Jang, J. Wolf, W.S. Kwon, and K.W. Paik, Electron. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 2002), pp. 1213-1220.
13. T.Y. Lee and K.N. Tu, J. Appl. Phys. 90, 4502 (2001).
14. H. Gan and K.N. Tu, Electron. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 2002), pp. 1206-1212.
15. K.N. Tu, C.C. Yeh, C.Y. Liu, and C. Chen, Appl. Phys. Lett. 76, 988 (2000).
16. T.Y.T. Lee, T.Y. Lee, and K.N. Tu, Electron. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 2001), pp. 558-563.
17. E.C.C. Yeh and K.N. Tu, J. Appl. Phys. 89, 3203 (2001).
18. E.C.C. Yeh, W.J. Choi, and K.N. Tu, Appl. Phys. Lett. 80, 580 (2002).
19. W.J. Choi, E.C.C. Yeh, and K.N. Tu, ECTC, Electron. Comp. Technol. Conf. (Piscataway, NJ: IEEE, 2002), pp. 1201-1205.