Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints

Journal of Applied Physics

Volumn 102, Issue 4, 2007, Pages

  Yang, Dan ^a   Wu, B Y ^a   Chan, Y C ^a   Tu, K N ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b Engineering IV

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CURRENT DENSITY; MAPPING; MELTING POINT; MICROSTRUCTURAL EVOLUTION; PHASE SEPARATION; TEMPERATURE MEASUREMENT; THERMAL GRADIENTS;

ELEMENT MAPPING ANALYSIS; PB ACCUMULATION; THERMOMIGRATION;

FLIP CHIP DEVICES;

EID: 34548455398     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2769270     Document Type: Article

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