Electromigration effects upon interfacial reactions in flip-chip solder joints

Materials Transactions

Volumn 45, Issue 3, 2004, Pages 661-665

  Chen, Sinn Wen ^a   Lin, Shih Kang ^a   Jao, Jui Meng ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Electromigration; Flip chip; Interfacial reactions

Indexed keywords

ELECTRIC CURRENTS; ELECTROMIGRATION; EUTECTICS; INTERFACES (MATERIALS); NICKEL; SOLDERED JOINTS; SOLUBILITY; SUBSTRATES;

DIFFUSION RATES; ELECTRIC CURRENT STRESSING; FLIP-CHIP JOINTS; INTERFACIAL REACTIONS;

FLIP CHIP DEVICES;

EID: 2442553940     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.661     Document Type: Article

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