Electromigration induced ductile-to-brittle transition in lead-free solder joints

Applied Physics Letters

Volumn 89, Issue 14, 2006, Pages

  Ren, Fei ^a,c   Nah, Jae Woong ^a   Tu, K N ^a   Xiong, Bingshou ^b   Xu, Luhua ^b   Pang, John H L ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATHODE INTERFACE; CHIP SOLDER JOINTS; POLARITY EFFECT;

BRITTLENESS; DUCTILITY; ELECTROMIGRATION; EUTECTICS; INTERFACES (MATERIALS); STRAIN RATE; TENSILE STRESS;

SOLDERED JOINTS;

EID: 33749457152     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2358113     Document Type: Article

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