Three-dimensional simulation on current-density distribution in flip-chip solder joints under electric current stressing

Journal of Applied Physics

Volumn 98, Issue 4, 2005, Pages

  Shao, T L ^a   Liang, S W ^a   Lin, T C ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CROWDING RATIO; ELECTRIC CURRENT STRESSING; ELECTROMIGRATION FAILURE; UNDERBUMP METALLIZATION (UBM);

COMPUTER SIMULATION; ELECTROMIGRATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; SOLDERED JOINTS; THICK FILMS; THIN FILMS;

CURRENT DENSITY;

EID: 25144443073     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2000667     Document Type: Article

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