Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature

Journal of Applied Physics

Volumn 98, Issue 1, 2005, Pages

  Nah, J W ^a   Suh, J O ^a   Tu, K N ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP COMPOSITES; ROOM TEMPERATURE; THIN-FILM METALS; UNDER BUMP METALLURGY (UBM);

COMPUTER SIMULATION; DIFFUSION; ELECTROMIGRATION; FLIP CHIP DEVICES; METALLURGY; THERMAL DIFFUSION; THIN FILMS;

SOLDERED JOINTS;

EID: 22944433854     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1949719     Document Type: Article

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