Investigation of void nucleation and propagation during electromigration of flip-chip solder joints using x-ray microscopy

Applied Physics Letters

Volumn 89, Issue 26, 2006, Pages

  Chiu, S H ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; ELECTROMIGRATION; INTERFACES (MATERIALS); INTERMETALLICS; MICROSCOPIC EXAMINATION; NUCLEATION;

COMPOSITIONAL CHANGES; GROWTH VELOCITY; RETARDED GROWTH; VOIDS; X-RAY MICROSCOPY;

SOLDERED JOINTS;

EID: 33846050481     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2425040     Document Type: Article

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