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Journal of Electronic Materials

Volumn 37, Issue 1, 2008, Pages 96-101

Effect of UBM thickness on the mean time to failure of flip-chip solder joints under electromigration

(4) Lin, Y L a Lai, Y S b Lin, Y W c Kao, C R c

a NATIONAL CENTRAL UNIVERSITY (Taiwan)

b ADVANCED SEMICONDUCTOR ENGINEERING INC (Taiwan)

c NATIONAL TAIWAN UNIVERSITY (Taiwan)

Author keywords

Electromigration; Flip chip; Solder

Indexed keywords

FAILURE MODELS; FLIP-CHIP SOLDER JOINTS; NONCONDUCTIVE FLOW;

CURRENT DENSITY; ELECTROMIGRATION; FILM THICKNESS; FLIP CHIP DEVICES; RELIABILITY THEORY; SURFACE CHEMISTRY;

SOLDERED JOINTS;

EID: 37249038598 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-007-0293-3 Document Type: Article

Times cited : (23)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.