Thermomigration in eutectic tin-lead flip chip solder joints

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 565-569

  Yang, Dan ^a   Alam, M O ^a   Wu, B Y ^a   Chan, Y C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CHIP SCALE PACKAGES; CONCRETE PAVEMENTS; ELECTRONICS PACKAGING; EUTECTICS; FLIP CHIP DEVICES; GRADIENT METHODS; LEAD; LEAD ALLOYS; PHASE SEPARATION; SOLDERED JOINTS; TECHNOLOGY; TEMPERATURE; TEMPERATURE SENSORS; THERMAL GRADIENTS; TIN; TITANIUM COMPOUNDS; WELDING;

AMBIENT TEMPERATURES; COLD SIDE; FLIP CHIP SOLDER JOINTS; MICRO-STRUCTURAL; MICROSTRUCTURAL COARSENING; PACKAGING TECHNOLOGIES; PHASE SEGREGATIONS; SOLDER JOINTS; TEMPERATURE DIFFERENCES; TEMPERATURE GRADIENTS; THERMOMIGRATION;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 48049105441     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342775     Document Type: Conference Paper

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