Fatigue and bridging study of high-aspect-ratio multicopper-column flip-chip interconnects through solder joint shape modeling

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 3, 2006, Pages 560-569

  Liao, E B ^a,b   Tay, Andrew A O ^b   Ang, Simon S T ^c   Feng, Han Hua ^a   Nagarajan, R ^a   Kripesh, V ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^c UNIVERSITY OF ARKANSAS   (United States)

Author keywords

Flip chip; Multicopper column (MCC) interconnect; Solder bridging; Soler joint shape; Terms Fatigue; Wafer level packaging

Indexed keywords

ASPECT RATIO; COMPUTATIONAL GEOMETRY; COPPER; FATIGUE OF MATERIALS; MATHEMATICAL MODELS; NUMERICAL ANALYSIS; STRAIN; STRESS ANALYSIS;

FLIP-CHIP INTERCONNECTS; MULTICOPPER-COLUMN (MCC) INTERCONNECT; SOLDER BRIDGING; SOLDER JOINT SHAPE; WAFER-LEVEL PACKAGING;

SOLDERED JOINTS;

EID: 33748626563     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.880509     Document Type: Article

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