Effect of contact metallization on electromigration reliability of Pb-free solder joints

Journal of Applied Physics

Volumn 99, Issue 9, 2006, Pages

  Ding, Min ^a   Wang, Guotao ^a   Chao, Brook ^a   Ho, Paul S ^a   Su, Peng ^b   Uehling, Trent ^b  

^a UNIVERSITY OF TEXAS AT AUSTIN   (United States)

^b FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT METALLIZATION; INTERFACIAL CRACKS; PB-FREE SOLDER JOINTS; UNDERBUMP METALLIZATION (UBM);

ACTIVATION ENERGY; COMPOSITION; CRACKS; DISSOLUTION; ELECTROMIGRATION; EUTECTICS; FAILURE ANALYSIS; INTERFACES (MATERIALS); INTERMETALLICS; METALLIZING; RELIABILITY; SOLDERED JOINTS; TIN COMPOUNDS;

LEAD;

EID: 33646883535     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2193037     Document Type: Article

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