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Applied Physics Letters

Volumn 80, Issue 4, 2002, Pages 580-582

Current-crowding-induced electromigration failure in flip chip solder joints

(5) Yeh, Everett C C a Choi, W J a Tu, K N a Elenius, Peter b Balkan, Haluk b

a UNIVERSITY OF CALIFORNIA (United States)

b Flip Chip Technologies (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT AREAS; CONTACT INTERFACE; CURRENT CROWDING; ELECTROMIGRATION FAILURES; ELECTROMIGRATION RESISTANCE; FLIP CHIP SOLDER BUMP; FLIP CHIP SOLDER JOINTS; INTERCONNECT WIRES; LARGE CURRENT; ORDERS OF MAGNITUDE; SOLDER BUMP; UNIFORM CURRENT DISTRIBUTION; VOID FORMATION;

ELECTROMIGRATION; FLIP CHIP DEVICES; SOLDERING ALLOYS; WIRE;

SOLDERING;

EID: 79958223410 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.1432443 Document Type: Article

Times cited : (349)

References (14)

1
- 79958203284
- 1999 International Roadmafor semiconductor Technology, Semiconductor Industry Association, San Jose, CA
- -1999 International Roadmap for semiconductor Technology, Semiconductor Industry Association, San Jose, CA.

2
- 0002334929
- Surface Mount International Conference and Exposition
- S. Brandenbery and S. Yeh, in "Surface Mount International Conference and Exposition," SMI 98 Proceedings, p. 337 (1998).
- (1998) SMI 98 Proceedings , vol.337
- Brandenbery, S.¹ Yeh, S.²

3
- 0032614180
- apl APPLAB 0003-6951
- C. Y. Liu, Chih Chen, C. N. Liao, and K. N. Tu, Appl. Phys. Lett. 75, 58 (1999). apl APPLAB 0003-6951
- (1999) Appl. Phys. Lett. , vol.75 , pp. 58
- Liu, C.Y.¹ Chen, C.² Liao, C.N.³ Tu, K.N.⁴

4
- 0000145348
- jaJAPIAU 0021-8979
- C. Y. Liu, Chih Chen, and K. N. Tu, J. Appl. Phys. 88, 5703 (2000). jap JAPIAU 0021-8979
- (2000) J. Appl. Phys. , vol.88 , pp. 5703
- Liu, C.Y.¹ Chen, C.² Tu, K.N.³

5
- 0035868113
- jaJAPIAU 0021-8979
- T. Y. Lee, K. N. Tu, S. M. Kuo, and D. R. Frear, J. Appl. Phys. 89, 3189 (2001). jap JAPIAU 0021-8979
- (2001) J. Appl. Phys. , vol.89 , pp. 3189
- Lee, T.Y.¹ Tu, K.N.² Kuo, S.M.³ Frear, D.R.⁴

6
- 0001714232
- Academic, New York
- F. M. d'Heurle and R. Rosenberg, Physics of Thin Films, (Academic, New York, 1973), Vol. 7, p. 257.
- (1973) Physics of Thin Films , vol.7 , pp. 257
- D'Heurle, F.M.¹ Rosenberg, R.²

7
- 1842617942
- rpRPPHAG 0034-4885
- P. S. Ho and T. Kwok, Rep. Prog. Phys. 52, 301 (1989). rpp RPPHAG 0034-4885
- (1989) Rep. Prog. Phys. , vol.52 , pp. 301
- Ho, P.S.¹ Kwok, T.²

8
- 0031695978
- mcMCHPDR 0254-0584
- C. K. Hu and J. M. E. Harper, Mater. Chem. Phys. 52, 5 (1998). mcp MCHPDR 0254-0584
- (1998) Mater. Chem. Phys. , vol.52 , pp. 5
- Hu, C.K.¹ Harper, J.M.E.²

9
- 0348235975
- jaJAPIAU 0021-8979
- E. C. C. Yeh and K. Y. J. Hsu, J. Appl. Phys. 83, 326 (1998). jap JAPIAU 0021-8979
- (1998) J. Appl. Phys. , vol.83 , pp. 326
- Yeh, E.C.C.¹ Hsu, K.Y.J.²

10
- 0001610086
- jaJAPIAU 0021-8979
- E. C. C. Yeh and K. N. Tu, J. Appl. Phys. 88, 5680 (2000). jap JAPIAU 0021-8979
- (2000) J. Appl. Phys. , vol.88 , pp. 5680
- Yeh, E.C.C.¹ Tu, K.N.²

11
- 0035868168
- jaJAPIAU 0021-8979
- E. C. C. Yeh and K. N. Tu, J. Appl. Phys. 89, 3203 (2001). jap JAPIAU 0021-8979
- (2001) J. Appl. Phys. , vol.89 , pp. 3203
- Yeh, E.C.C.¹ Tu, K.N.²

12
- 49749201891
- H. B. Huntington and A. R. Grone, J. Phys. Solids 20, 76 (1961).
- (1961) J. Phys. Solids , vol.20 , pp. 76
- Huntington, H.B.¹ Grone, A.R.²

13
- 0000741863
- jaJAPIAU 0021-8979
- C. Y. Liu, K. N. Tu, T. T. Sheng, C. H. Tung, D. R. Frear, and P. Elenius, J. Appl. Phys. 87, 750 (2000). jap JAPIAU 0021-8979
- (2000) J. Appl. Phys. , vol.87 , pp. 750
- Liu, C.Y.¹ Tu, K.N.² Sheng, T.T.³ Tung, C.H.⁴ Frear, D.R.⁵ Elenius, P.⁶

14
- 79958218569
- unpublished
- W. J. Choi, unpublished.
- Choi, W.J.¹

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