Studies on solder bump electromigration in Cu/Sn-3Ag-0.5Cu/Cu system

Microelectronics Reliability

Volumn 47, Issue 8, 2007, Pages 1280-1287

  Yamanaka, Kimihiro ^a   Tsukada, Yutaka ^a   Suganuma, Katsuaki ^b  

^a KYOCERA CORPORATION   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CURRENT DENSITY; ELECTROMIGRATION; NUCLEATION; SOLDERED JOINTS; SOLDERING ALLOYS;

ELECTRON ENTRY POINT; JUNCTION LINE; SOLDER DEPLETION;

TERNARY SYSTEMS;

EID: 34547165632     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.09.028     Document Type: Article

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