Study of electromigration-induced Cu consumption in the flip-chip SnCu solder bumps

Journal of Applied Physics

Volumn 100, Issue 8, 2006, Pages

  Liu, C Y ^a   Ke, Lin ^a   Chuang, Y C ^a   Wang, S J ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; DISSOLUTION; ELECTROMIGRATION; FLIP CHIP DEVICES; STRESSES;

CRITICAL TEMPERATURE; CURRENT STRESSING; ELECTROMIGRATION (EM) TEMPERATURE;

SOLDERED JOINTS;

EID: 33750495216     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2357860     Document Type: Article

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