Local melting induced by electromigration in flip-chip solder joints

Journal of Electronic Materials

Volumn 35, Issue 5, 2006, Pages 1005-1009

  Tsai, C M ^a   Lin, Y L ^a   Tsai, J Y ^a   Lai, Y I Shao ^b   Kao, C R ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Electromigration; Flip chip; Local melting; PbSn solder

Indexed keywords

FLIP CHIPS; JOULE HEATING; LOCAL MELTING; PBSN SOLDERS;

CURRENT DENSITY; ELECTRIC RESISTANCE; ELECTROMIGRATION; EUTECTICS; LEAD COMPOUNDS; MICROSTRUCTURE;

SOLDERED JOINTS;

EID: 33745065485     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692560     Document Type: Conference Paper

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