Electromigration and thermomigration characteristics in flip chip Sn-3.5Ag solder bump

Journal of Korean Institute of Metals and Materials

Volumn 46, Issue 5, 2008, Pages 310-314

  Lee, Jang Hee ^b   Lim, Gi Tae ^b   Yang, Seung Taek ^a   Suh, Min Suk ^a   Chung, Qwan Ho ^a   Byun, Kwang Yoo ^a   Park, Young Bae ^a  

^a Andong National University   (South Korea)

^b NONE

Author keywords

Electromigration; Flip chip Pb free solder bump; Joule heating; Sn 3.5Ag solder; Thermomigration

Indexed keywords

EID: 47949085376     PISSN: 17388228     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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