Thermomigration in Pb-free SnAg solder joint under alternating current stressing

Applied Physics Letters

Volumn 94, Issue 9, 2009, Pages

  Hsiao, Hsiang Yao ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; LITHIUM BATTERIES; MICROELECTRONICS; SOLDERING ALLOYS; THERMOANALYSIS; TIN; WELDING;

ALTERNATING CURRENTS; LEAD-FREE SOLDERS; MICROELECTRONICS INDUSTRIES; MOLAR HEATS; PB-FREE; SN-AG SOLDERS; SOLDER JOINTS; THERMOMIGRATION;

LEAD;

EID: 62149085090     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3089872     Document Type: Article

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