Damage mechanics of low temperature electromigration and thermomigration

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 2, 2009, Pages 478-485

  Li, Shidong ^a   Abdulhamid, Mohd F ^a   Basaran, Cemal ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

Copper; Current density; Damage mechanics; Electromigration; Equations; Force; Mathematical model; Power electronics packaging; Solder joint reliability; Soldering; Thermomigration

Indexed keywords

DAMAGE MECHANICS; EQUATIONS; FORCE; SOLDER JOINT RELIABILITY; THERMOMIGRATION;

BRAZING; COMPUTER SIMULATION; ELECTROMIGRATION; ELECTRONICS PACKAGING; MECHANICS; POWER ELECTRONICS; RELIABILITY; WELDING;

MATHEMATICAL MODELS;

EID: 67349144009     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.2005840     Document Type: Article

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