Thermomigration in flip-chip SnPb solder joints under alternating current stressing

Applied Physics Letters

Volumn 90, Issue 15, 2007, Pages

  Hsiao, Hsiang Yao ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CURRENTS; ELECTROMIGRATION; FOCUSED ION BEAMS; SOLDERED JOINTS; TIN COMPOUNDS;

ALTERNATING CURRENTS; THERMAL GRADIENT; THERMOMIGRATION;

FLIP CHIP DEVICES;

EID: 34247241706     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2721136     Document Type: Article

References (8)

1. K. N. Tu, J. Appl. Phys. 94, 5451 (2003).
2. H. Ye, C. Basaran, and D. C. Hopkins, Appl. Phys. Lett. 82, 1045 (2003).
3. Annie T. Huang, A. M. Gusak, and K. N. Tu, Appl. Phys. Lett. 88, 141911 (2006).
4. Y. C. Chuang and C. Y. Liu, Appl. Phys. Lett. 88, 174105 (2006).
5. S. W. Liang, Y. W. Chang, and Chih Chen, Appl. Phys. Lett. 88, 172108 (2006).
6. S. H. Chiu, T. L. Shao, and Chih Chen, Appl. Phys. Lett. 88, 022110 (2006).
7. Y. Adda and J. Philibert, Solid State Phys. 22, 409 (1986).
8. D. Gupta, K. Vieregge, and W. Gust, Acta Mater. 5, 47 (1999).