Direct measurement of hot-spot temperature in flip-chip solder joints under current stressing using infrared microscopy

Journal of Applied Physics

Volumn 104, Issue 3, 2008, Pages

  Hsiao, Hsiang Yao ^a   Liang, S W ^a   Ku, Min Feng ^a   Chen, Chih ^a   Yao, Da Jeng ^b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; CURRENT DENSITY; ELECTROMIGRATION; FLIP CHIP DEVICES; METALLIZING; MOLECULAR BEAM EPITAXY; WELDING;

CURRENT STRESSING; DIRECT MEASUREMENTS; EXPERIMENTAL DATA; FLIP CHIPPING; HOT SPOTTING; HOT-SPOT TEMPERATURE; INFRARED MICROSCOPY; INITIAL FAILURE; METALLIZATION; PEAK CURRENT DENSITIES; SIMULATION STUDIES; SOLDER BUMPING; SOLDER JOINTS;

SOLDERING;

EID: 49749118348     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2949279     Document Type: Article

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