Electromigration of eutectic SnPb solder interconnects for flip chip technology

Journal of Applied Physics

Volumn 89, Issue 6, 2001, Pages 3189-3194

  Lee, T Y ^a   Tu, K N ^a   Kuo, S M ^b   Frear, D R ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035868113     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1342023     Document Type: Article

References (16)

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