Three-dimensional thermoelectrical simulation in flip-chip solder joints with thick underbump metallizations during accelerated electromigration testing

Journal of Electronic Materials

Volumn 36, Issue 2, 2007, Pages 159-167

  Liang, S W ^a   Chang, Y W ^a   Chen, Chih ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Electromigration; Flip chip solder joint; Simulation; Under bump metallization

Indexed keywords

CURRENT CROWDING EFFECT; ELECTROMIGRATION TESTING; FLIP CHIP SOLDER JOINTS; THERMOELECTRICAL SIMULATION;

ELECTROMIGRATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; METALLIZING; TEMPERATURE DISTRIBUTION; THERMOELECTRICITY; THREE DIMENSIONAL;

SOLDERED JOINTS;

EID: 33947601743     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0060-x     Document Type: Article

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