Electromigration and thermomigration behavior of flip chip solder joints in high current density packages

Journal of Materials Research

Volumn 23, Issue 9, 2008, Pages 2333-2339

  Yang, D ^a   Chan, Y C ^a   Wu, B Y ^a   Pecht, M ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC PHYSICS; ATOMS; BRAZING; CURRENT DENSITY; ELECTROMIGRATION; FLIP CHIP DEVICES; METALLIZING; SOLDERED JOINTS; THERMOANALYSIS; TIN; TITANIUM COMPOUNDS; WELDING;

AMBIENT TEMPERATURES; ATOMIC FLUXES; ATOMIC MIGRATION; CURRENT CROWDING; ELECTRON WIND FORCES; FLIP CHIP SOLDER JOINTS; HIGH CURRENT DENSITIES; MORPHOLOGICAL VARIATIONS; SOLDER JOINTS; TEMPERATURE COEFFICIENT OF RESISTANCE; THERMAL INFRARED; THERMOMIGRATION;

LEAD;

EID: 52649093434     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2008.0305     Document Type: Article

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