Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

Applied Physics Letters

Volumn 88, Issue 1, 2006, Pages

  Zhang, Lingyun ^a   Ou, Shengquan ^a   Huang, Joanne ^a   Tu, K N ^a   Gee, Stephen ^b   Nguyen, Luu ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTINUITY CONDITION; CURRENT CROWDING; VACANCY FLUXES; VOID PROPAGATION;

COPPER; ELECTROMIGRATION; FLIP CHIP DEVICES; INTERFACES (MATERIALS); INTERMETALLICS;

SOLDERED JOINTS;

EID: 33645517630     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2158702     Document Type: Article

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