Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints

Journal of Electronic Materials

Volumn 35, Issue 5, 2006, Pages 1010-1016

  Lin, Y L ^a   Chang, C W ^a   Tsai, C M ^a   Lee, C W ^b   Kao, C R ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Current crowding; Electromigration; Flip chip; Solder

Indexed keywords

CURRENT CROWDING; FLIP CHIPS; SOLDERS; UNDER BUMP METALLURGY (UBM);

ELECTROMIGRATION; EUTECTICS; FAILURE (MECHANICAL); LEAD COMPOUNDS; METALLURGY; SUBSTRATES;

SOLDERED JOINTS;

EID: 33745085927     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692561     Document Type: Conference Paper

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