Study of the thermal stress in a Pb-free half-bump solder joint under current stressing

Applied Physics Letters

Volumn 90, Issue 23, 2007, Pages

  Wu, B Y ^a   Chan, Y C ^a   Zhong, H W ^a   Alam, M O ^b   Lai, J K L ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; ELECTRIC CURRENTS; ELECTROMIGRATION; EXTRUSION; INTERFACES (COMPUTER); LEAD; THERMAL STRESS;

CURRENT STRESSING; ELECTROMIGRATION FORCE; STRESS MIGRATION FORCE; VOID FORMATION;

SOLDERED JOINTS;

EID: 34250766176     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2747183     Document Type: Article

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