Electromigration test on void formation and failure mechanism of FCBGA lead-free solder joints

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 1, 2009, Pages 79-88

  Jen, Ming Hwa R ^a   Liu, Lee Cheng ^a   Lai, Yi Shao ^b  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Current crowding; Electromigration (EM); In situ; Intermetallic compound (IMC); Lead free solder bump; Polarity effect; Void

Indexed keywords

BRAZING; ELECTROMIGRATION; LEAD; LEAD COMPOUNDS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SOLDERED JOINTS; SOLDERING ALLOYS; SUBSTRATES; WELDING;

CURRENT CROWDING; IN SITU; INTERMETALLIC COMPOUND (IMC); LEAD-FREE SOLDER BUMP; POLARITY EFFECT; VOID;

FAILURE ANALYSIS;

EID: 63049107200     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2004579     Document Type: Article

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