SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 2, 2009, Pages 221-226

The influence of an imposed current on the creep of Sn-Ag-Cu solder

(6) Kinney, Christopher a Morris Jr , J W a Lee, Tae Kyu b Liu, Kuo Chuan b Xue, Jie b Towne, Dave b

a University of California Berkeley (United States)

b CISCO SYSTEMS (United States)

Author keywords

Creep; Current; Electromigration; Joule heating; Solder joint

Indexed keywords

AMBIENT TEMPERATURES; AS CASTS; CREEP RATES; CURRENT; DIFFERENT MICROSTRUCTURES; ISOTHERMAL EXPOSURES; ISOTHERMAL TESTS; PRELIMINARY TESTS; ROOM TEMPERATURES; SHARP INCREASES; SN-AG-CU; SOLDER JOINT;

BRAZING; COPPER; CREEP; ELECTROMIGRATION; HEATING; JOULE HEATING; LEAD; MICROSTRUCTURE; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TESTING; TIN ALLOYS; WELDING;

TIN;

EID: 58349107026 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0568-3 Document Type: Article

Times cited : (32)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.